Intex is thrilled to be attending the BOINZ 57^th Annual Conference and Expo in Wellington, New Zealand from May 20. It is an incredible opportunity to connect with industry leaders and to showcase our innovative, game-changing Qubit360™ - “Solving Movement in TALL Buildings”. The theme of this year’s BOINZ event is “Building resilience”, resonating with Intex’ absolute goal of achieving with its Qubit360™ Total Frame Isolation methodology.